About the role
Position: Product Line Manager, Optical I/O Chiplets Location: San Jose, CA Job Id: 644 # of Openings: 0 Product Line Manager – Optical I/O Chiplets Location: San Jose (on-site) Ayar Labs is shattering AI data bottlenecks by moving data at the speed of light. As pioneers of co-packaged optics (CPO), we use light instead of electricity to move data faster, further, and with a fraction of the energy needed to fuel the explosive growth of AI models. Backed by NVIDIA, AMD, and Intel and manufactured in partnership with the world's leading semiconductor ecosystem, Ayar Labs' co-packaged optics solution is key to unleashing next-generation AI scale-up architectures. You will own the commercial and technical success of TeraPHY™, our optical I/O chiplet product line — one of the most advanced heterogeneous silicon products in the industry. This is a chip productization role: you drive the product from definition through tapeout, bring-up, qualification, and high-volume manufacturing, then position it to win the AI scale-up market. We're looking for a product leader who has taken a complex advanced-node chip or SoC from concept to volume production. Experience with networking, optics and photonics is a plus. Key
Responsibilities Product Strategy & Roadmap: Own the product strategy for the TeraPHY™ optical chiplet family. Author comprehensive PRDs that set the direction for engineering and manufacturing execution. Silicon Productization: Drive the chiplet through the full product lifecycle — definition, tapeout, silicon bring-up, reliability qualification, test/yield ramp, and high-volume manufacturing. Steer the product through the internal PLC (Product Life Cycle) gate process in partnership with Engineering, Quality, Operations, and foundry/OSAT partners. Market Intelligence: Track the evolution of AI clusters, networking switch fabrics, and disaggregated memory to shape the I/O chiplet roadmap with target customers. Technical Marketing: Develop high-quality white papers, datasheets, application notes, and other collateral aimed at customers and partners. Customer Engagement: Act as the primary interface for Tier 1 Cloud Service Providers (CSPs), xPU architects, and networking OEMs on chiplet integration, co-packaging, and deployment into their platforms. Basic
