As part of your responsibilities, you will be:

• Serve as the primary on-site interface between HyperLight and external manufacturing partners, including foundries test team and test OSAT vendors, to ensure seamless production execution.
• Work closely with external manufacturing partners and equipment vendors to debug any test-related issues (both hardware and software) encountered to minimize downtime and disruption to production
• Own and drive wafer-level backend execution across foundry and OSAT partners—including wafer-level dicing/singulation, bumping, and assembly—covering prioritization, scheduling, vendor readiness, and day-to-day execution to meet production timelines and delivery commitments.
• Ensure the integrity, accuracy, and organization of data received from foundries and OSATs, enabling effective analysis and decision-making.
• Collaborate with cross-functional teams (test engineering, process engineering, operations, and quality) to troubleshoot backend process yield, test-related issues.
• Coordinate with internal stakeholders and external partners to identify root causes and drive timely resolution of yield excursions and test anomalies.
• Oversee the implementation of corrective actions at both foundry test and OSAT sites and monitor the effectiveness of solutions through yield and test metrics tracking.
• Drive continuous improvement initiatives for production workflows, focusing on efficiency, quality, and cycle time reduction.
• Partner with operations teams to optimize wafer flow from foundry to OSAT, ensuring smooth logistics and minimal delays.
• Work closely with test engineering teams to reduce production test time while maintaining coverage and product quality.
• Develop and maintain clear communication and reporting on production status, issues, and improvement initiatives with internal and external stakeholders.

Requirements

• Bachelor’s or master’s degree in Electrical engineering, Electronics Engineering, Materials Science, Photonics, or a related technical discipline.

• Minimum 5 years of experience in semiconductor test, product engineering, or manufacturing operations, with direct engagement with foundries and OSAT partners.

• Deep expertise in semiconductor backend (post-fab) manufacturing—with strong, hands-on understanding of wafer-level dicing, bumping, and assembly—including:

• Wafer sort / probe (wafer test)

• Wafer-level dicing/singulation: street layout awareness, saw/laser process fundamentals, tape/film selection, kerf/edge quality control, and dicing-to-pick handling.

• Wafer bumping (e.g., Cu pillar / solder bump): process flow understanding (UBM/metallization, plating, reflow), bump metrology, reliability risks, and supplier control plans.

• Die/chiplet assembly and packaging: die attach, pick-and-place/flip-chip, underfill/encapsulation, substrate/interposer considerations, and in-process quality checks through final test readiness.

• Proven track record managing OSAT operations end-to-end, including production scheduling, execution, yield tracking, and vendor performance management.

• Strong experience in yield engineering and data-driven problem solving, with demonstrated ability to lead root cause analysis and drive corrective actions to closure across external partners.

• Hands-on expertise in optical testing, including characterization, validation, and troubleshooting of photonic or optical devices is a plus

• Advanced analytical skills with strong proficiency in Python for data analysis, automation, and yield modelling.

• Solid experience with LabVIEW for test automation, instrumentation control, and data acquisition in production or R&D environments.

• Strong understanding of cost-of-test drivers and test optimization, with demonstrated impact on test time reduction and production efficiency.

• Experience leading cross-functional initiatives across test engineering, process, operations, and external vendors, with the ability to influence without direct authority.

• Excellent communication and stakeholder management skills, with experience presenting data, issues, and recommendations to both technical and executive audiences.

• Self-directed, results-oriented, and comfortable operating in a fast-paced, high-ambiguity environment, with strong ownership and accountability.

Benefits

• Competitive market-based compensation and benefits
• Professional growth and mentorship opportunities

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