About the role
Advanced Packaging Engineer – Design & Signal Integrity
Who we are: We are a stealth-mode startup building foundational technology to address performance, scalability, and resiliency challenges in large-scale AI data center clusters. We are backed by top-tier VC firms and notable angel investors. The company is led by experienced builders and operators who have founded companies, taken them to scale, and exited successfully. We work with a strong sense of unity and shared responsibility, and we expect trust, integrity, and respect in how we collaborate and make decisions. We hold ourselves accountable to one another and to the quality of the work we deliver. Headquartered in Silicon Valley, we operate across a mix of remote and on-site locations in the U.S. and Canada. We aim to create an environment where people are treated fairly, supported in their growth, and are empowered to do meaningful work alongside others who take the craft seriously. Some Recent Press: https://www.eetimes.com/startup-boosts-scale-up-to-1000-gpus-in-a-single-domain/ What we need: We are looking for an Electrical Engineer for ASIC Package Design & Signal Integrity to design, model, and validate advanced semiconductor packages to ensure high-speed data and power integrity, focusing on minimizing noise, reflections, and ensuring manufacturability for custom chips Key tasks include running simulations (using tools like Ansys HFSS, Cadence Sigrity, ADS), defining package specifications, collaborating with IC designers and suppliers, analyzing power delivery networks (PDN), and debugging hardware for high-speed interfaces (UCIe,Ethernet). Key
Responsibilities: Package Development: Select and design optimal multi-die IC package types considering electrical performance, cost, and manufacturability. Signal Integrity (SI) Analysis: Perform pre- and post-layout simulations (e.g., eye diagrams, crosstalk) for high-speed interfaces (UCIe, D2D, high-speed serdes). Power Integrity (PI) Analysis: Model and simulate Power Delivery Networks (PDN) for low-voltage, high-current supplies, including AC/DC analysis and IR drop. Modeling & Simulation: Develop accurate simulation models (S-parameters, IBIS-AMI) for packages, PCBs, and sockets. Cross-Functional Collaboration: Work with IC design, physical design, board layout, and marketing teams to define
