Advanced Packaging Multi-Physics Modeling Engineer
About the role
About
the Team: OpenAI’s Hardware organization develops silicon and system-level solutions designed for the unique demands of advanced AI workloads.
The team is responsible for building the next generation of AI-native silicon while working closely with software and research partners to co-design hardware tightly integrated with AI models. In addition to delivering production-grade silicon for OpenAI’s supercomputing infrastructure,
the team also creates custom design tools and methodologies that accelerate innovation and enable hardware optimized specifically for AI. Role Overview: We are seeking a highly motivated engineer to lead multi-physics modeling and simulation for next-generation advanced packaging systems. This role focuses on the co-optimization of thermal, mechanical, and electrical interactions across chip, package, and system levels to enable high-performance AI/HPC advanced packaging solutions. The candidate will collaborate closely with cross-functional engineering teams and external partners to predict and optimize package mechanical, electrical and thermal performance, and system scalability for advanced heterogeneous integration platforms. In this role you will: Lead multi-physics modeling and simulation across thermal, mechanical, and electrical domains for next-generation AI/HPC advanced packaging systems. Drive co-optimization of chip, package, and system interactions to improve power integrity, thermal performance, mechanical reliability, and overall package scalability. Develop and validate electro-thermal-mechanical simulation methodologies for heterogeneous integration platforms including 2.5D/3D packaging, HBM integration, and chiplet architectures. Perform reliability assessment and root-cause analysis for package warpage, stress, underfill interaction, solder fatigue, electromigration, and thermo-mechanical failures. Correlate simulation results with silicon, hardware measurements, and reliability test data to improve modeling accuracy and design predictability. You might thrive in this role if you have: Enjoy solving extremely challenging thermal, mechanical and electrical challenges for some of the most advanced AI/HPC packaging technology. Are motivated by pushing the limits of heterogeneous integration, high-power delivery, advanced cooling, and large-scale packaging architectures. Like developing new modeling methodologies and engineering solutions rather than relying only on conventional industry approaches. Want to influence real product architecture decisions through simulation-driven insights across chip, package, cooling, and system design. Enjoy learning broadly across semiconductor technologies, including chip architecture, power delivery, package integration, materials, cooling, and system-level interactions. Strong experience in thermal and mechanical modeling for advanced packaging systems. Solid understanding of electro-thermal interactions and temperature-dependent electrical behavior. Experience solving complex chip/package/system integration challenges using multi-physics simulation and first-principles engineering approaches. Hands-on experience with finite element analysis (FEA) and multi-physics simulation tools such as ANSYS, COMSOL, Abaqus, Icepak, or equivalent. Knowledge of package reliability mechanisms including warpage, solder fatigue, underfill stress, electromigration (EM), and thermo-mechanical interactions. Preferred
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