Job Details: Job Description: Note: This role is only open to external candidates with industry dry etch experience from leading equipment suppliers or advanced foundries. You will operate in a high impact space, partnering closely with cross functional teams (Process Integration, Manufacturing, Equipment Engineering, Yield/Defect Engineering, and suppliers) to solve complex technical challenges and establish long term systems that sustain performance. This role requires regular onsite presence to fulfill essential job
responsibilities. • Drives technology development for both high volume manufacturing and future technology, provides process integration and equipment solutions, and performs feasibility studies to meet desired device specifications. • Own and drive development of next generation patterning processes, including process architecture, optimization strategies, and qualification methodologies. • Performs pathfinding activities in support of process and hardware development on existing and first of kind equipment, enabling manufacturing of innovative device architectures and develops roadmaps for technologies enabling future roadmap. • Provide technical leadership for cross functional problem solving to resolve complex process and defect issues; drive structured root cause, containment, and permanent corrective actions. • Design and execute comprehensive characterization plans; plan and conduct experiments (DOE/response surface/robustness studies) across the development cycle. • Establish and mature control systems to optimize and sustain production performance (SPC, control plans, alarms, response plans, recipe governance, sustaining systems). • Develop strategies and infrastructure to resolve difficult problems and implement systems to manage these problems in the future (standard work, monitoring, dashboards/analytics, knowledge capture). • Drive improvements in yield, reliability, cost, productivity, and process capability, ensuring scalable transfer to manufacturing and ongoing sustainment. • Influence technical direction, mentor engineers (as appropriate for grade), and communicate status/risks clearly to stakeholders. • Recommends and implements modifications for operating equipment to improve production efficiency, manufacturing techniques, and optimizing production output for existing products. • Partners with key equipment and materials suppliers to develop and implement enabling elements of the technology. Performs process technology feasibility studies through theoretical simulations and/or practical engineering methods.
Qualifications: Minimum
Qualifications - PhD in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a semiconductor related STEM field with 4+ years of industry experience in dry etch at a leading foundry or equipment supplier with relevant experience. Or - Master's degree in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a semiconductor related STEM field with 6+ years of industry experience in dry etch at a leading foundry or equipment supplier with relevant experience. Or -Bachelor's degree in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a semiconductor related STEM field with 8+ years of industry experience in dry etch at a leading foundry or equipment supplier with relevant experience. Relevant recent experience includes, but is not limited to: - Hands-on experience in dry etch semiconductor manufacturing, including ownership of process development and optimization. - Strong command of plasma etch fundamentals, including plasma generation, plasma-surface interactions, selectivity, profile control, and defect mechanisms. - Demonstrated record of delivering dry etch process solutions that improved yield, reliability, performance, or manufacturability for advanced technology nodes at foundry or suppliers. - Expertise in statistical analysis and DOE methodologies, using tools such as JMP, Python, or MATLAB to drive data-based decisions. Preferred
Qualifications: - 5+ years of direct experience developing and deploying dry etch processes for advanced logic or foundry technologies. - Experience with advanced dry etch technologies such as: ICP / CCP plasma etch, High aspect ratio etch (HARC), Atomic Layer Etch (ALE), Radical and Vapor phase isotropic etching, Ash and surface treatments, EUV patterned layer etch integration. - Demonstrated ability to manage complex process challenges and provide solutions such as pattern fidelity, CD control, defectivity, variability reduction, or process window expansion. - Strong understanding of logic BEOL interconnects and their etch integration
requirements. - Experience with materials and device characterization techniques, including SEM, TEM, CD SEM, AFM, XPS, or electrical correlation. - Ability to define technical approaches, de risk options, and guide less senior engineers through complex problem solving. - Proven ability to lead technical problem solving across projects, influencing peers and stakeholders without formal people management responsibility. - Evidence of broader technical influence, such as internal technology disclosures, patents, publications, or recognized subject matter expertise within the organization. - Strong collaboration and problem-solving skills to work effectively in cross-disciplinary teams. - Proven ability to communicate technical data and concepts to both technical and non-technical audiences. Join Intel's dynamic team and contribute to groundbreaking advancements in technology. Help us shape the future today. Job Type: Experienced Hire Shift: Shift 1 (United States of America) Primary Location: US, Oregon, Hillsboro Additional Locations: Posting Statement: All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Position of Trust N/A
Benefits We offer a total
compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the
benefits of working at Intel. Annual Salary Range for jobs which could be performed in the US: $133,800.00-255,200.00 USD The range displayed on this job posting reflects the minimum and maximum target
compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific
compensation range for your preferred location during the hiring process. Work Model for this Role This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change. * ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter. Intel’s official careers website. Find your next job and take on projects that shape tomorrow’s technology.
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