About the role
About Syenta Syenta is pioneering a new era in semiconductor manufacturing with our groundbreaking Localised Electrochemical Manufacturing (LEM) technology. Our manufacturing products build cutting edge advanced packaging for the semiconductor industry by combining patterning and metallization into a single tool. We do that by achieving high-speed, high-resolution metallization at significantly lower costs and energy use, while minimizing emissions and waste. Founded in Australia, our growing footprint in the US represents a key milestone in our journey. We are building a world-class team where seasoned engineers and ambitious emerging talent collaborate to solve some of the toughest challenges in semiconductor manufacturing.
About
the Role We are seeking a Process Engineer (Metallization) to support the development and optimization of Syenta’s core LEM metallization processes. This is a hands-on, high-impact role working at the heart of our technology — bridging experimental R&D, process engineering, and early-stage manufacturing. You will take ownership of designing and executing experiments, improving process performance, and translating learnings into robust, repeatable workflows. Working closely with cross-functional teams, you will play a key role in advancing our prototype systems toward scalable production.
Responsibilities Electroplating Process Ownership Support the development and performance of electroplating processes within Syenta’s LEM platform Develop and refine electrolyte chemistries, including optimization of additive systems (suppressors, accelerators, levellers, inhibitors) Define electrochemical deposition windows that balance performance, repeatability, and manufacturability Drive improvements in film properties including adhesion, stress, microstructure, uniformity, and defectivity Process Development & Optimization Design and execute structured experiments (DOE, parameter sweeps) across tightly coupled chemical and process variables Optimise deposition conditions (e.g. current density, waveform, transport effects) to improve yield and consistency Establish process control strategies, acceptance criteria, and repeatability standards Translate experimental results into actionable process improvements Defect Analysis & Process Improvement Investigate plating defects such as voids, seams, roughness, non-uniformity, stress cracking, and adhesion failures Correlate defects to chemistry, interfaces, transport, waveform, and tool behavior Implement corrective actions to improve process robustness and reduce variability Build mechanistic understanding to support long-term stability and scalability Scale-Up & Manufacturing Integration Translate lab-scale processes into stable, repeatable manufacturing workflows Support process transfer to pilot lines and external fabrication partners Identify and mitigate risks related to yield, cost, and scalability Contribute to process standardization and documentation for manufacturing readiness Technical Leadership & Cross-Functional Collaboration Act as a subject matter expert in electroplating and electrochemistry within the organization Work closely with materials, hardware, and product teams to integrate metallization processes into the broader system