Wafer Packaging Manufacturing - Wafer Level Assembly Department Manager

Job Details: Job Description: About the Group: Wafer Packaging Manufacturing (WPM) is part of APTM (Advanced Packaging Technology and Manufacturing) within Intel Foundry and consists of a worldwide factory network specializing in the processing and testing of product as we make interconnects and transform wafers into die.

About

the Role The WPM NM WLA (Wafer level assembly) Department Manager is responsible for all aspects of factory operations including safety, quality, employee development, product velocity, spending, and ramping of new products and technologies related to Wafer level assembly segment of the line in New Mexico. A successful candidate will be a senior leader who has an established track record of delivering world-class operational results. This position requires close collaboration with stakeholders across many organizations including Assembly Test Manufacturing (ATM), Global Supply Chain (GSC), Manufacturing Integration Technology (MIT), Customer Quality Network (CQN), Environment, Health & Safety (EHS), Factory Systems Manufacturing (FSM), Logic Technology Development (LTD), Sort Technology Development (STTD), Assembly Test Technology Development (ATTD). The WLA Department Manager is responsible for, but not be limited to: Maintaining a safety-first culture and injury-free environment that proactively identifies safety issues associated with new equipment and processes and responding to employee safety concerns and physical discomfort. Sustaining quality focus maintaining very high yields and preventing escapes of discrepant materials to downstream operations through proactive identification and mitigation of risks, and root cause analysis and corrective actions for events that impact product quality. Ensuring a variety of career and skills development opportunities are available for the organization, as well as building a highly motivated workforce. Ensuring that the right products and the right volumes are delivered at the right time to meet business needs and coordinate operational strategy with partner factories in Oregon, Chengdu, China and Kulim, Malaysia. Monitoring and controlling spending, staying below target, and deliver reductions over time. The ideal candidate should exhibit the following behavioral traits Effective communicator up and down the organization. Skills to motivate and drive toward a high-performing, large organization. Demonstrated results and accountability for broad leadership, building of followership and role modeling of Intel values and cultural attributes. Required Skills and Experience Semiconductor engineering management experience within the last 2 years 6+ years demonstrated the ability to lead technical taskforces and resolve complex technical issues. A detailed understanding of process control systems and methodologies. Preferred Skills and Experience Experience in Technology Development, ramp and HVM of Advance Packaging solutions Semiconductor process development experience. Demonstrated the capability of working in a high performing team culture which includes: setting high expectations, driving performance to those expectations with a high sense of urgency, role modeling the desired culture, possessing excellent teamwork and leadership skills, and demonstrated problem solving and prioritization skills. Demonstrated technical leadership and a track record of problem solving with creativity and out-of-box thinking.