Materials Engineer, AI Satellites (Starmind)

SpaceX was founded under the belief that a future where humanity is out exploring the stars is fundamentally more exciting than one where we are not. Today SpaceX is actively developing the technologies to make this possible, with the ultimate goal of enabling human life on Mars. MATERIALS ENGINEER, AI SATELLITES (STARMIND) SpaceX is leveraging its experience deploying and operating the world’s largest satellite constellation to develop Starmind, a new constellation of satellites capturing solar energy in space to power low-cost, high-performance AI compute for Earth. Realizing this vision demands highly reliable, high performance electrical compute hardware, solar power systems, thermal radiators, and more. These systems must operate in the extreme environment of space while delivering the connectivity, control, power distribution, and processing needed for orbital AI inference. The Starmind team designs, builds, and operates the orbital compute fabric of the future. We develop nearly every key piece of technology in house – from the satellites’ flight computers and power systems to the fully custom compute electronics, memory, and networking that form the brain of our on-orbit data centers. As a Materials Engineer on the Starmind team, you’ll have ownership over the entire life-cycle of the hardware that enables advanced on-orbit AI processing and data center workloads. Your work sits at the intersection of process, packaging, mechanical, and thermal engineering. The Payload team is responsible for the design of industry-leading compute electronics, memory, and networking in order to achieve required domain sizes and processing workloads.

RESPONSIBILITIES: Rapidly develop high-reliability microelectronics packages, cooling systems, and radiator hardware for satellites. Own the full lifecycle of materials specification, validation, and process development— including device modeling, characterization of performance metrics, and materials failure analysis. Drive system trades,

requirements capture, materials selection, prototyping, manufacturing, failure analysis. Build supply chains for build-up layers, plating chemicals, coatings, thermal interface materials, and other materials for compute and satellite manufacturing. Define incoming acceptance criteria for materials. Address materials and process challenges in advanced packaging while spearheading the development of next-generation TIM materials to improve packaging performance. Specify and implement in-process metrology tools for quality control. Design thermal test vehicles and test setups to evaluate material/electronic properties. Integrate simulation tools with experimental data to guide and drive targeted improvements via material or process changes. Work closely with engineers from adjacent disciplines (mechanical, thermal, electrical, software, test engineering, supply chain, silicon design, etc.) to deliver tightly integrated, high-performance hardware Challenge assumptions, question