About the role
Position: Director, ASIC Physical Design Location: Bengaluru, India Job Id: 602 # of Openings: 0 Director, ASIC Physical Design Location: Bengaluru (on-site, flexible hours) Ayar Labs is shattering AI data bottlenecks by moving data at the speed of light. As pioneers of co-packaged optics (CPO), we are using light instead of electricity to move data faster, further, and with a fraction of the energy needed to fuel the explosive growth of AI models. Backed by industry giants like NVIDIA, AMD, MediaTek and Intel and manufactured in partnership with the world’s leading semiconductor ecosystem, Ayar Labs’ co-packaged optics solution is key to unleashing next-generation AI scale-up architectures. We are seeking a Director of ASIC Physical Design to develop and tape out the next generation of electronic-photonic integrated chips. The candidate will be responsible for leading the ASIC integration team, performing design integration, physical design, and tapeouts of ICs containing custom analog, photonic, and digital subsystems implemented in both 3DIC and specialty platforms. The ideal candidate will be a mission-driven team leader with management and leadership experience in product-focused organizations, with a comprehensive silicon development background, a track record of first-silicon successes, and eagerness to apply specialized ASIC skillsets to a wide range of problems. Essential Functions: Manage and grow the skillsets of an experienced ASIC integration team which has successfully taped out multiple generations of Ayar Labs SoCs Drive timely execution of both test chip and product tapeouts Develop and improve upon complex SoC integration flows integrating photonics, circuits, advanced nodes, and 3DIC integration in leading edge nodes Oversee digital-top physical design and RTL2GDS flows: synthesis, place and route, and static timing analysis Drive clear and effective decision-making across multiple functions and teams within the organization Implement SoC signoff and cross-check methodologies to deliver high-quality tapeouts incorporating a wide range of disciplines Maintain EDA infrastructure for the broader design organization Basic
