2027校招-封装工程师/Packaging Engineer at Texas Instruments | Standout | Standout

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Texas Instruments

2027校招-封装工程师/Packaging Engineer

Chengdu, No.8-8 Kexin Road

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Interested?

Let me introduce you to the founders.

Skip the process

Job details

Location

Chengdu, No.8-8 Kexin Road

Company

NameTexas Instruments

IndustryElectrical/Electronic Manufacturing

Team Size32442

Funding

StandoutYBacked by Y Combinator · P26

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Last stage

Public

Investors

Elliott Management

Vanguard Group

BlackRock

U.S. Department of Commerce

Founders

CH

Cecil H. Green

Co-Founder

JE

J. Erik Jonsson

Co-Founder

PE

Patrick E. Haggerty

Co-Founder

What happens next.

No applications, no recruiter spam. Just the intro.

01

Confirm the fit

A few questions to make sure this role is the right shape for you. Two minutes.

02

I pitch you to the company

I write the intro, send it to the founder, and handle the back-and-forth.

03

A meeting lands on your calendar

If they’re a yes, I book the chat. You show up — that’s the whole job-hunt.