About the role
About Marvell Marvell’s semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, and carrier architectures, our innovative technology is enabling new possibilities. At Marvell, you can affect the arc of individual lives, lift the trajectory of entire industries, and fuel the transformative potential of tomorrow. For those looking to make their mark on purposeful and enduring innovation, above and beyond fleeting trends, Marvell is a place to thrive, learn, and lead. Your Team, Your Impact The Signal Integrity Engineering Group (SIE) is a one-stop shop for all matters related to signal/power integrity (SI/PI), board design, and package design. The SIE team tailors a board and package design solution that fits every switch product according to the specific device SI/PI, performance, and cost targets and looks at each solution holistically. Looking at the holistic solution enables each of the SIE group members a unique opportunity to influence Marvell switch devices most profoundly and allows Marvell to supply our customers with the most adequate tailored end-to-end solution. What You Can Expect Develop creative power solutions for Marvell devices at package and system levels. Evaluate designs to ensure they meet challenging electrical performance
requirements. Collaborate closely with layout engineers and IP teams to optimize power delivery network (PDN) performance. Perform simulations, including new EDA tool evaluations, flow development, and scripting for efficiency improvements. Develop creative signal integrity solutions for Marvell high speed device interfaces, develop and prove solution with electromagnetic simulation tools
What We're Looking For BSc and 10-15 years of related experience; Degree in Electrical Engineering Deep power integrity expertise with signal integrity, inductance, and capacitance knowledge. Strong understanding of package and board implementation limitations. Experience in power delivery network (PDN) design, modeling, and analysis using tools such as PowerSI and SIwave. Experience with 3D electro-magnetic extraction tools, such as Ansys HFSS —advantage. Good knowledge of power supply designs, hands on measurement experience - Advantage Proven ability to collaborate effectively with engineers across multiple geographies. Excellent communication, presentation, and documentation skills. Experience with 2.5D/3D package development—advantage. Familiarity with packaging technologies, materials, substrate design rules, and assembly processes—advantage Deep knowledge of signal integrity concepts Expertise in High-Speed signal integrity for Interfaces such as DDR4, PCIe Gen3/4, 10G/25G/ 50G/100G/200Gbps Ethernet - Advantage Familiarity with Cadence Allegro schematics and layout tools - Demonstrates good analysis and problem-solving skills. Has an inherent sense of urgency and accountability. - Grounded, detail-oriented, always backs up ideas with facts. Educational background Additional