Job Details: Job Description: Job Description: The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms. Within APTM, the Assembly Technology Development (ATD) team pioneers innovative package assembly solutions and scales them for high-volume manufacturing. The Packaging Module Development Engineer will contribute to advancing technology and foundry capabilities by: • Developing First Level/Second Level Interconnect (FLI/SLI), Thermal solutions (TIM1), and SMT/PCB technologies to support Intel's future packaging platforms. • Collaborating with multifunctional and cross-organizational teams to optimize assembly processes for quality, reliability, cost, yield, productivity, and manufacturability. • Innovating next generation equipment, materials and fabrication processes to enhance semiconductor packaging capabilities at scale. • Managing projects to meet product development timelines. • Applying formal education and judgment to solve technical problems. • Providing sustaining support for equipment performance and process health in high-volume manufacturing. • Responding promptly to foundry customer requests and events. The ideal candidate will demonstrate: • Technical leadership, strategic planning, and critical thinking. • Ability to coach and develop technical teams. • Tolerance for ambiguity and adaptability in a dynamic environment. • Flexibility in managing changing priorities and
responsibilities. • Experience leading teams in a highly matrixed organization. • Initiative and ability to work independently. • Strong communication, influencing, technical, and analytical skills. This position requires regular onsite presence.
Qualifications: You must possess the below minimum
qualifications to be initially considered for this position. Preferred
qualifications are in addition to the minimum
qualifications and are considered a plus factor in identifying top candidates. Experience listed below would be obtained through a combination of your schoolwork, classes, research, relevant previous job, and/or internship experiences. Minimum
Qualifications • PhD in Materials Science, Mechanical Engineering, Electrical Engineering, Physics/Applied Physics, or a related STEM field with 6+ months of relevant experience • Minimum GPA of 3.5 • At least one publication in a peer-reviewed technical journal. • Must have the required degree prior to your start date. • Relevant experience and deep understanding in solid mechanics applying thermal mechanical coupling behaviors into degradation. (Thermal Cycling impact) Preferred
Qualifications One or more years of experience in any of the following: • Technology development, including familiarity with Statistical Process Control (SPC) and/or Design of Experiments (DOE). • Delivering results for complex, time-critical technical projects. • Semiconductor fabrication processes and technology. • Previous related work experience in a semiconductor foundry. Job Type: College Grad Shift: Shift 1 (United States of America) Primary Location: US, Arizona, Phoenix Additional Locations: Posting Statement: All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Position of Trust N/A
Benefits We offer a total
compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the
benefits of working at Intel. Annual Salary Range for jobs which could be performed in the US: $133,800.00-188,890.00 USD The range displayed on this job posting reflects the minimum and maximum target
compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific
compensation range for your preferred location during the hiring process. Work Model for this Role This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change. * ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter. Intel’s official careers website. Find your next job and take on projects that shape tomorrow’s technology.
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